Equip-Link
Explore our high-performance optical transceiver modules and Ethernet connectivity options engineered for seamless network integration, interoperability, and durability.
The fiber optic infrastructure landscape is transforming, driven by high-bandwidth demands, edge computing, and artificial intelligence model deployments.
Traditional architectures are reaching their physical limits. The integration of silicon photonics allows optical systems to be manufactured on silicon chips, reducing cost, improving thermal dissipation, and scaling bandwidth seamlessly to 800G and 1.6T configurations.
BiDi (Bidirectional) SFP+ modules optimize existing physical fiber infrastructure. By using split wavelengths (e.g., 1270nm/1330nm or 1490nm/1550nm) to transmit and receive data simultaneously over a single strand of fiber, network operators cut fiber installation costs in half.
Enterprises are shifting away from vendor lock-in. Sourcing MSA-compliant, third-party SFP modules with custom-flashed compatibility firmware allows system integrators to save up to 70% in capital expenditures while retaining Tier-1 performance.
Empowering global connectivity with high-reliability engineering, scalable manufacturing capacity, and customizable transceiver solutions.
Founded in 2017, Equip-Link Intelligent Equipment (Shenzhen) Co., Ltd. is a leading manufacturer and supplier of high-performance optical transceivers and fiber optic communication solutions. We specialize in the design, development, production, and global distribution of optical modules for data centers, telecommunications networks, enterprise networking, cloud computing, and AI infrastructure applications.
Our modern manufacturing facility covers an area of 380 square meters and is equipped with advanced production and testing equipment to ensure consistent quality and reliable performance. With an annual export revenue exceeding USD 18 million, Equip-Link has established long-term partnerships with customers in more than 50 countries and regions worldwide.
With 9 years of export experience and 14 years of industry expertise, our team understands the evolving demands of global communication networks and delivers products that meet international standards for performance, compatibility, and reliability.
Our state-of-the-art production workflow guarantees zero-defect manufacturing, utilizing advanced automated testing equipment at every stage.
Rigorous incoming component screening including PCBAs, optical lasers, and photo-diodes.
High-precision customized casing design ensuring structural integrity and thermal dissipation.
Assembly inside cleanrooms to prevent optical path contamination.
Anti-static protection and tailored label configuration for OEM customers.
Climate-controlled inventory management ensuring prompt shipment timelines.
Our specialized laboratories and quality assurance inspectors evaluate performance across multiple environmental and signal testing conditions.
Delivering structural parts with tolerance control down to the micrometer level.
Subjects optical hardware to thermal shock (-40°C to +85°C) to ensure deployment reliability.
Ensures minimal attenuation and maximizes signal performance across all optical fiber connectors.
Detects microscopic contaminants to prevent back-reflection and connection degradation.
Quality is at the core of everything we do. We implement a comprehensive quality management system supported by incoming material inspection, in-process quality control, and final product testing. Every product undergoes rigorous testing using advanced optical and network performance analyzers before shipment. Our dedicated quality assurance team consists of 36 experienced inspectors who ensure that every product meets customer requirements and industry specifications.
Innovation drives our growth. Our R&D department is staffed by 68 professional engineers dedicated to developing next-generation optical communication technologies. In the past year alone, we successfully launched 126 new products, further expanding our portfolio of high-speed optical transceivers, including 10G, 25G, 40G, 100G, 200G, 400G, and 800G solutions.
Our transceivers and interconnect products are optimized for a wide array of application spaces, adapting to local infrastructure requirements.
Providing low-latency 10G SFP+ to 100G/400G QSFP-DD links. Optimized for high-density environments requiring strict thermal dissipation characteristics and low electrical power profiles.
Delivering long-haul transmission options (10km to 100km) utilizing advanced single-mode BiDi transceiver links to maximize carrier fiber capacity without running additional cabling.
Engineered modules verified by our thermal shock labs to run consistently between -40°C and +85°C. Crucial for smart city sensor grids, oil fields, and factory automation pipelines.
By integrating a specialized testing lab with an ecosystem of over 1,280 qualified partners, Equip-Link offers unmatched production speed and pricing advantages.
We flash diagnostic software and host key firmware configurations locally on the module, validating absolute device compatibility with Cisco, Juniper, Huawei, HP, and Arista switches.
With 68 R&D engineers, we bring new designs from digital blueprint to operational physical prototype in a fraction of standard timelines, maintaining 120+ yearly product launches.
Our supply network of 1,280+ partner entities prevents single-point-of-failure delays, ensuring a reliable flow of materials even during global semiconductor shortages.
Learn more about transceivers, compatibility profiles, testing procedures, and global sourcing setups.
Browse our extended line of bidirectional optical modules, copper connectors, and EMI-shielded cage enclosures designed for stable network configurations.